電子零件結構熱管理
Thermal Management of Electronic Equipment
學期
108-1
學分
3
學分
當期課號
5352
永久課號
IAP5140
開課單位
工學院碩士在職專班-精密組
授課教師
陳恒隆
校區
光復
類別
選修
上課時間表
| 節 | 週二 |
|---|---|
A 18:30–19:20 | 電子零件結構熱管理 EE230 3 節連堂 |
B 19:30–20:20 | |
C 20:30–21:20 |
* 根據陽明交大上課時間表所列
概述
The objective of this course is to provide basic understanding for heat dissipation design of electronic devices used in PCs / Servers / Communication system, etc..
評分方式
Exercise: 20% Quiz: 25% Midterm; 30% Final 40%
週次計畫
| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction to formulas for for thermal design of electronic equipment |
| 第 2 週 | Introduction to the modes of heat transfer in electronic equipment |
| 第 3 週 | Formulas of conduction heat transfer in electronics equipment |
| 第 4 週 | Thermal conduction / steady state |
| 第 5 週 | Thermal conduction / transient state |
| 第 6 週 | Discrete heat sources and thermal spreading |
| 第 7 週 | Formulas for fluid dynamics for electronic equipment |
| 第 8 週 | Loss coefficients and dynamic drag |
| 第 9 週 | Fans and pumps |
| 第 10 週 | Convection heat transfer in electronic equipment |
| 第 11 週 | Boundary layer theory and dimensionless group |
| 第 12 週 | Force convection & natural convection |
| 第 13 週 | Radiation heat transfer in electronic equipment |
| 第 14 週 | Heat transfer with two phase flow |
| 第 15 週 | Introduction of heat pipe and Vapor Chamber |
| 第 16 週 | Combined modes of heat transfer for electronic equipment |
| 第 17 週 | Liquid cooling system I |
教科書
Thermal design of electronic equipment by Ralph remsburg, CRC Press, 2000
Office Hours
- 地點
- EE474
- 時間
- Anytime
- 聯絡方式
- tel: 55105; e-mail:ccwang@mail.nctu.edu.tw