低溫電漿原理與應用
Fundamentals and Applications of Low-temperature Plasmas
| 節 | 週一 |
|---|---|
A 18:30–19:20 | 低溫電漿原理與應用 EE130 3 節連堂 |
B 19:30–20:20 | |
C 20:30–21:20 |
* 根據陽明交大上課時間表所列
1. Introduce the fundamental electromagnetics for students with mechanical engineering background. 2. Introduce the operational principles of plasma physics in various kinds of plasma chamber in semiconductor materials processing. 3. Introduce the developments in simulation and experimental techniques for plasma flows in materials processing. 4. Hands-on measurements using Langmuir probe for typical low-temperature plasmas. 5. Hands-on simulations using fluid modeling and PIC-MCC methods for typical DC & RF gas discharge.
Fluid Mechanics, Eng. Math.
1. Homework: 40% (n times) 2. Midterm exam: 30% 3. Final Project Report: 30% (1D PIC code developed by the students)
- Introduction to Plasma
- Single Charged Particle Motion
- Fundamentals of Plasma Equations and Equilibrium
- Atomic Collisions (Molecular Collision: optional)
- Plasma Dynamics in Weakly Ionized Plasma
- Diffusion and Transport of Plasma
- DC Sheaths
- Particle and Energy Balance in Discharges
- Capacitively Discharges
- Inductively Discharges
- Wave-Heated Discharges
- Plasma Processing and Related Topics
************ Course notes will be distributed during classes ***************** 1. Principles of Plasma Discharge and Materials Processing by M.A. Lieberman and A.J. Lichtenberg, John Wiley & Sons, Inc, 1994. 2. Introduction to Plasma Theory by D.R. Nicholson, Krieger Publishing Company, Florida, 1991. 3. Plasma Physics Via Computer Simulation by C.K. Birdsall and A.B. Langdon, McGraw-Hill Book Company, 1985. 4. Non-Equilibrium Air Plasmas at Atmospheric Pressure by K.H. Becker, U. Kogelschatz, K.H. Schoenbach and R.J. Barker, Taylor & Francis, 2004.