電子構裝技術

This course will teach the fundamentals for packaging, including bonding, diffusion, surfaces. It will also cover science and technology of microelectronic packaging. Die Attach/Chip Bond, Wire Bond, Flip Chip Technology, Ball Grid Array Technology, Pb-based and Pb-free Solders, Ceramic Packaging, Plastic Packaging, Printed Circuit Boards, Chip Scale Packaging, Direct Chip Attach, system in packaging, state-of-the-art 3D IC packaging, Company visiting. Metallurgical reactions between Cu-Sn, Ni-Sn, and Sn-Au. Sn whisker, Stress in thin films, Mean-time-to-failure measurement, Phase transformation and phase diagrams of solders.

Two midterms : 40%, Final :20%; Term paper-paper critique : 20% Presentation : 20%

Textbook: 1. K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability (Springer 2007) Reference books: Textbook: 1. K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability (Springer 2007) Reference books: 1. “Flip chip technologies” John H. Lau, McGraw-Hill, 1996. 2. “Electronic Packaging, Design, Materials, Process, and Reliability”John Lau, C.P. Wong, John L. Prince, and Wataru Nakayama, McGraw-Hill. 3. “Principles of Electronic Packaging”Donald P. Seraphim, Ronald C. Lasky, Che-yu Li, McGraw-Hill, 1993. 4. “Ball Grid Technology”John H. Lau, McGraw-Hill, 1995. 6. “Chip Scale Packaging” John H. Lau, S.W. Ricky Lee, McGraw-Hill, 1999. 5. “Fundamentals of Microsystems Packaging”, R.R. Tummala, McGraw-Hill, 2001 6微電子材料與製程,陳力俊主編中國材料科學學會 2000 7. Microelectronics packaging handbook” R.R. Tummala and E.J. Rymaszewski, Van Nostrand Reinhold, 1989. 8. Electronic Thin Film Science: For Electrical Engineers and Materials Scientists Tu, King-Ning/ Mayer, James W./ Feldman, Leonard C.

地點

EF310

時間

TBA

聯絡方式

31814