進階複合物半導體元件整合及應用
Advances in Compound Semiconductor Devices Integration and Application
| 節 | 週五 |
|---|---|
2 09:00–09:50 | 進階複合物半導體元件整合及應用 EE118 3 節連堂 |
3 10:10–11:00 | |
4 11:10–12:00 |
* 根據陽明交大上課時間表所列
This graduate level course will cover: Physics, modeling, bandgap engineering, design and application of compound semiconductor devices with emphasis on high frequency HEMT and HBT. 2-D material based devices, Terra hertz technology, EM behavior and quantum structures will be covered. Properties, processing, theory and practice of such devices will be covered. Stacking of devices to increase breakdown will be presented. Heterogeneous integration of various types of devices such as Microwave/MMW MMICs, lasers, displays and digital circuitry on a single substrate will be covered. Learning will be provided on device characterization using S-parameters. Packaging, combining and integration of chips will be discussed. AS part of application of these devices, LNA, filter, and antenna will be designed considering MMW single chip receiver as an example.
Course will cover physics of traditional (HEMT, MESFET and HBT etc.) and advanced devices based on 2-D materials, quantum structure and terahertz substrates. Their application will be covered.
Lecture notes will be provided by TA's.
1) Attendance-10% 2) Midterm Exam: 30% 3) Final exam- 30% 4) Final Presentation-30%
| 週次 | 主題 |
|---|---|
| 第 1 週 | Physics, modeling, bandgap engineering |
| 第 2 週 | 228 Memorial Day (Holiday) |
| 第 3 週 | design and application of compound semiconductor devices with emphasis on high frequency HEMT |
| 第 4 週 | design and application of compound semiconductor devices with emphasis on high frequency HBT |
| 第 5 週 | 2-D material based devices |
| 第 6 週 | EM behavior and quantum structures |
| 第 7 週 | Holiday Adjustment (no class) |
| 第 8 週 | Properties, processing , theory and practice of 2-D material devices |
| 第 9 週 | Techniques for increasing breakdown |
| 第 10 週 | Stacking of 2D material devices |
| 第 11 週 | Heterogeneous integration of various types of devices such as Microwave/MMW MMICs |
| 第 12 週 | lasers, displays and digital circuitry on a single substrate |
| 第 13 週 | device characterization using S-parameters. |
| 第 14 週 | Terra hertz technology |
| 第 15 週 | Application: antenna design |
| 第 16 週 | Application: filter |
| 第 17 週 | Application: LNA |
| 第 18 週 | Packaging, combining and integration of chips |
No good text book (under evaluation) is available currently. Hence instructor notes will be used for teaching. However, following books will be consulted (all of these books are available in NCTU library): 1) Compound semiconductor materials and devices Morgan & Claypool Publishers, 2016. 2) Compound semiconductor technology, Colliver, David J. Dedham, Mass: Artech House c1976. 3) Compound semiconductor device modelling, London : Springer-Verlag c1993.
- 地點
- By Appointment
- 時間
- By Appointment
- 聯絡方式
- kppande@nctu.edu.tw