高科技廠房設施設計

課程概述 The purpose of this course is to provide basic design knowledge needed for fabrication facilities that support high-tech manufacturing and R&D. High-tech includes, not limited to, the advanced technologies applied in the fields of micro-electronics, optoelectronics, precision equipment, telecommunication, nanotech, pharmaceutics, biotech, medical devices, animal experiment, and Aerospace. The processes undertaken in high-tech manufacturing plants and R&D labs require cleanrooms with extremely stringent environmental control. The environmental control includes temperature and humidity requirements, air/water quality, purity of chemicals and gases, noise and vibration degree, electromagnetic and radio frequency interference, electrostatic discharge, materials out-gassing, safe grounding, assurance of personnel health, safety and security and prevention of biohazard. The focus of this course is on designing cleanroom and engineering its associated facilities. Students will gain skills needed to meet ever-changing challenge of delivering an ultra-pure cleanroom and ultra-pure process utilities. Moreover, this course will strengthen students’ understanding and background in constructing high-tech manufacturing fab/plant and research lab. 課程目標 1. Differentiate the typical processes in semiconductor, biotech, medical devices, and pharmaceutical manufacturing and R&D. 2. Explain the interdisciplinary nature of high-tech manufacturing and research. 3. Classify cleanrooms in terms of various international standards. 4. Perform architectural design for cleanroom and schematically layout factory. 5. Use the basic theories and principles to design systems for heating, ventilation and air conditioning (HVAC,) water/air treatment, noise and vibration mitigation. 6. Specify the environmental control criteria for cleanroom in terms of temperature and humidity level, air/water quality, purity of chemicals and gases, noise and vibration degree, electromagnetic and radio frequency interference, electrostatic discharge, materials outgassing, and safe grounding. 7. Apply the knowledge in testing and commissioning cleanroom and its associated facilities. 8. Establish contamination control programs for constructing, operating, and maintaining the high-tech facilities. 9. Address the issues in automatically managing the emergency, safety, and security systems. 10. Link to the information sources for further studies in nano/micro fabrication and research.

具有應用科學、物理學、工程數學、及工程統計知識的能力。 具有設計及執行實驗,以及分析解釋數據的能力。 具有辨識、分析規劃及解決工程問題的能力。 具有描述各種不同的土木工程範疇的能力。 具有善用現代化科技及資訊工具的能力。 COURSE REQUIREMENTS: There is one group term project. The group term project tests the student understands of the principal concepts covered in the course within the context of a comprehensive “real-world” problem. It also provides an opportunity to develop skills for working in a project team context and communication skills. The group term project counts 60% of the final grade. The term project report should conform to good engineering practices and should include, as a minimum, a title page, abstract, table of contents, introduction, theories, real-world practice, comparison between theory and practice, conclusion and references. A good quality report contains well-indicated reference pages and balanced arguments with solid evidences. Individual student’s contribution to the report should be clearly indicated. A Final Exam is required on June 8, 2021. The Final Exam will be comprehensive and counted as 15% of “Total Grade.” Another 15% is for homework & class participation. Two unexcused absences will result in a grade of 'Incomplete' or 'Flunk', depending on whether or not the student is considered to be passing in all other aspects at the time of the third absence. Except in emergency, a student must attend the field trip. Unexcused absences will result in a final grade of 'Incomplete.' Meanwhile, each student will be individually required to take a lecture note on a selected class lecture and a field trip report, illustrated either in Chinese or in English. Then, prepare a maximum 5-page report (10%.) The page limitation imposes an organizational and summarization burden on the student who takes the lecture note and field trip report. The writing must be concise and turn in two weeks after the lecture or field trip. Although figures, tables and graphs often help present useful concepts in less space, the illustrative demonstration of understating on the lecture or field trip will be weighted heavily. Simply download from the provided slides and/or class handouts is not acceptable. The field trip report should conform to good engineering practices and should include, as a minimum, a title page, abstract, table of contents, introduction, theories behind the lecture, conclusion, and references. The report should be in the student’s own words; any citation should be clearly noted and/or referred.

CLASS HOURS: Tuesday, 6:30pm-9:20pm

1學期作業 (1). March 16, 2021 -- Joining a Group, and Selection of Focus Design Area, (2). April 27, 2021 -- 30% Design Complete (3). June 1, 2021 -- 60% Design Complete (4). June 15, 2021 -- Oral Presentation, Only PowerPoint slides are suitable for the presentation. The oral presentation should be 15 minutes in length which includes time for questions and discussion. (5). June 22, 2021 – E-mail in Your Individual Term Project Report. 2.考試狀況 (1). No Midterm Exam., Mandatory Field Trip on 5/22/2021 (2). Final Exam. (Open Book) 3.評量方法 (1). Term Project, Group Presentation – 40% (10%, 10%, 20%) (2). Term Project, Individual Report – 20% (3). Final Exam – 15% (4). Homework, Attendance, and Classroom Participation – 15% (5). Field Trip Report – 10%

• 廠房設計原則
• 廠房設計背景

1. Geng, Hwaiyu, Semiconductor Manufacturing Handbook, McGraw-Hill, New York, 2005. 2. Whyte, W., Cleanroom Design, John Wiley, 2nd ed., New York 1999. 3. McQuiston/Parker/Spitler, Heating, Ventilating, and Air Conditioning, John Wiley, 6th ed., New York 2005. 4. Nishi, Y., Doering, K., and Wooldridge, T., Handbook of Semiconductor Manufacturing Technology, Marcel Dekker, New York, 2000.