半導體元件可靠度及其失效物理

"Reliability is, after all, engineering in its most practical form" said by James R. Schlesinger - Former US Secretary of State for Defense. Reliability is an essential part of a successful semiconductor product because it is related to trust. No reliability is equal to no business. Especially, the new technologies based on the advanced designs and novel materials, e.g., FinFETs, high k dielectrics, wide bandgap, Ferroelectric, or 2D materials, cannot be commercialized without the proven reliability. Therefore, a good R&D engineer should recognize the statistical tools/characterization methods, identify the reliability issues,and evaluate failure physics, further designing for reliability. In this course, the basic semiconductor devices/processes, statistical tools, and characterization methods for reliability evaluation are covered. Furthermore, four most important main reliability challenges (Bias temperature instability & interface traps / Time dependent dielectric breakdown / Mass transport-induced failures / Electrostatic discharge (ESD)) will be addressed in this class. 前美國國防部部長 James R. Schlesinger曾說:可靠度是工程中最實際的層面。高可靠度是所有半導體產品成功的重要因素,因為可靠度與客戶對產品的信任有關。沒有可靠度等於沒有客戶的信賴而失去商業價值。對先進的半導體技術,例如FinFET、高介電常數絕緣層、寬能隙、鐵電或二維材料等,如果無法通過可靠度驗證,這些技術將無法商品化。因此,優秀的研發工程師應該具備評估可靠度所需統計工具/量測方法來確定可靠度問題,並評估特性衰退的物理特性,並進一步設計高可靠度產品。本課程中將深入淺出的介紹基本半導體元件/製程及可靠度評估所需的統計工具和量測方法。此外,本課程也將會探討四個最重要也最常見的半導體元件可靠度議題(偏壓溫度不穩定性和界面缺陷 Bias temperature instability & interface traps / 依時性閘極崩潰 Time dependent dielectric breakdown / 質量傳輸引起的故障 Mass transport-induced failures / 靜電放電 ESD)。 Intended Learning Outcomes (ILOs): By the end of this class, you should be able to: 1. Explain the basic operation principles and fabrication processes for the MOS type semiconductor technologies 2. Apply the basic statistics/statistical tools for reliability analysis 3. Evaluate the failure physics of reliability issues 4. Present the reliability issues using your own word 5. Design for reliability (DFR) 預期學習成果: 在本課程結束時,修課的學生能夠: 1.解釋MOS半導體技術的基本工作原理和製程 2.應用基本的統計工具進行可靠度分析 3.評估導致不穩定元件特性的失效物理機制 4.闡述對可靠度問題的見解 5.增強可靠度的元件設計(Design for reliability)

No requirement

投影片並搭配線上影音 Powerpoint with some video/on-line lectures are used. 電子筆記 Digital notes in the powerpoint are provided after each chapter. 參訪可靠度相關半導體廠商 Field trip to reliability testing and analysis-related industry is organized. 實際練習及使用量測機台進行半導體元件可靠度 Reliability measurement

***Due to the COVID 19, this course will temporarily be lectured online. ***We will switch back to the in-class lectures based on CDC information. 分組報告 An oral presentation based on a selected topic: 35% 期末open-book 考試 Final open-book written exam : 35% 作業 Homework: 15% 出席 Attendance: 15%

1. M. Ohring, Reliability and Failure of Electronic Materials and Devices, 2nd Edition, 2014. 2. Literature in reliability issues

地點

MicroInfo Research Center (MIRC) 601

時間

By appointment

聯絡方式

tlwu@nctu.edu.tw