微感測器原理與應用

This course is for students who have basic training about Micro-Electro-Mechanical systems (MEMS) and integrated circuit design. Emphasis is on the realization of an integrated MEMS system including a MEMS structure and the corresponding driving or signal conditioning circuits. Basic signal conditioning circuits will be introduced. After that, theoretical modeling of various physical phenomena, such as mechanical, thermal, electrostatic, and electronic, encountered in the design and application of MEMS sensors will be discussed. Prior knowledge of simulation and design tools are strongly recommended. Device and circuit design in homework and final projects are based on the CIC CMOS MEMS process. The final project should have complete design and layout of both the specific sensor and the signal conditioning circuits. During the course, students will have opportunities to run the integrated MEMS design flow from concept, analysis, simulation, to layout. Selected design will be realized using the CIC CMOS MEMS foundry service. Topics: 1. Introduction and review 2. Signal conditioning circuits 3. CMOS MEMS system integration 4. CMOS MEMS foundry service 5. Mechanical sensor 6. Thermal sensor (7. Optical sensor)

Introduction to MEMS, Electronic circuits, Integrated circuit design, finite-element simulation tools, circuit simulation tools

homework 45%, final project 50%, class performance 5%

主要參考書: S. D. Senturia, “Microsystem Design,” 2001 D. A. Johns and K. Martin, “Analog Integrated Circuit Design,” 2002 V. Kaajakari, “Practical MEMS,” 2009 其他參考書: H. Baltes, et al., eds, “CMOS MEMS,” 2005 J. W. Gardner, et al.,“Microsensors, MEMS, and Smart Devices,” 2003 M. Elwenspoek et al., “Mechanical Microsensors,” 2001 S. M. Sze, “Semiconductor Sensors,” 1994 B. Razavi, “Design of Analog CMOS Integrated Circuits,” 2001 R. J. Baker, “CMOS Mixed-signal Circuit Design,” 2005