先進微電子構裝技術
Advanced Microelectronic Packaging Technology
| 節 | 週一 |
|---|---|
A 18:30–19:20 | 先進微電子構裝技術 CM215 3 節連堂 |
B 19:30–20:20 | |
C 20:30–21:20 |
* 根據陽明交大上課時間表所列
本課程的教學目標在於使學生具備各種先進微電子構裝技術之相關知識與製程。課程將從半導體後段製程簡介開始,介紹電子構裝的主要架構、打線接合技術、凸塊技術、覆晶技術、2.5D/3D IC、光電LED構裝技術、MEMS構裝技術、未來封裝技術藍圖、下世代異質接合技術。同時亦將涵蓋電子構裝材料、CPI、Simulation、可靠度、失效分析等,以獲得完整的相關知識,並對電子構裝產業有更深入的瞭解,厚植專業能力,奠立學術研究與投入業界工作之基礎。另一方面,此課程亦將建立學生解決問題、資訊收集與專業口頭報告之能力。 The objectives of this course are to introduce the advanced microelectronic packaging technologies and its applications/process. Main topics of this course include: 1. Overview of microelectronic packaging & its trends 2. Conventional and advanced packaging technologies (wire bonding, bumping, WLCSP, flip chip) 3. 2.5D & 3D IC packaging 4. LED & MEMS packaging 5. TSV & Next generation heterogeneous bonding technology 6. Materials for electronic packaging & solder technology 7. Other perspective of microelectronic packaging, including CPI, electrical, thermal, mechanical stress, reliability, and failure analysis This course is a lecture-oriented course and requires students to give a final presentation in related topics. Hope to establish the knowledge of microelectronic packaging and further connect the knowledge to industrial applications. On the other hand, this course will establish the abilities of problem solving, information collection, and professional oral presentation skill for the students as well.
講授與討論(Lecture and Discussion)
期中考試: 35% 期末考試: 35% 專題口頭報告 (Final Presentation):20% 出席率 (Attendance):10%
| 週次 | 主題 |
|---|---|
| 第 1 週 | 課程介紹-先進微電子構裝在半導體產業的角色 (Introduction to Microelectronic Packaging) |
| 第 2 週 | 打線與晶圓凸塊技術 (Wire Bonding & Bumping Technology) |
| 第 3 週 | 放假 |
| 第 4 週 | 晶圓級晶粒尺寸構裝與覆晶構裝技術 (Wafer Level Chip Scale Package & Flip Chip Package) |
| 第 5 週 | 2.5D/3D IC構裝技術-1 (Introduction of 2.5D & 3D IC Technology-1) |
| 第 6 週 | 2.5D/3D IC構裝技術-2 (Introduction of 2.5D & 3D IC Technology-2) |
| 第 7 週 | 光電與微機電構裝技術介紹與應用 (LED Die Attach, Anisotropic Conductive Film (ACF), and MEMS Packaging Introduction and Application) |
| 第 8 週 | 放假 |
| 第 9 週 | 期中考 (Midterm Examination) |
| 第 10 週 | 矽穿孔技術 (Through Silicon Via Technology) |
| 第 11 週 | 下世代異質接合技術 (Next Generation Heterogeneous Bonding Technology) |
| 第 12 週 | 構裝材料與無鉛銲錫 (Materials for Electronic Packaging & Lead-Free Solder) |
| 第 13 週 | 構裝可靠度與失效分析 (Reliability & Failure Analysis) |
| 第 14 週 | 專題報告 (Final Presentation) |
| 第 15 週 | 專題報告 (Final Presentation) |
| 第 16 週 | 期末考 (Final Examination) |
ext Book 1. Lecture Reference Book 1. “3D Microelectronic Packaging-From Fundamentals to Applications”, edited by Yan Li and Deepak Goyal, Springer, 2017. 2. “Materials for Advanced Packaging”, edited by Daniel Lu and C. P. Wong, Springer, 2017. 3. “Advanced Flip Chip Packaging”, edited by Ho-Ming Tong, Yi-Shao Lai, and C.P. Wong, Springer, 2009. 4. “3D IC Integration and Packaging”, edited by John Lau, McGraw-Hill Inc., 2016. 5. 電子構裝技術與材料 陳信文等 編著 高立圖書公司
- 地點
- R530
- 時間
- 三 (Wed.) 15:00-17:00
- 聯絡方式
- 06-3032121 Ext.57822 or mail