封裝技術與設備
Packaging Technology and Equipment
學期
110-2
學分
3
學分
當期課號
5942
永久課號
VST5006
開課單位
國際半導體越南境外專班
授課教師
周武清
類別
必修
上課時間表
| 節 | 週一 |
|---|---|
A 18:30–19:20 | 封裝技術與設備 3 節連堂 |
B 19:30–20:20 | |
C 20:30–21:20 |
* 根據陽明交大上課時間表所列
概述
This course focuses on the fundamentals of microsystems packaging. The microsystems include microelectronics, photonics, RF, and MEMS.
先修科目
NO
評分方式
(a) 40% for 8 homework and assignments, (b) 30% for mid-term exam, and (c) 30% for final exam
週次計畫
| 週次 | 主題 |
|---|---|
| 第 1 週 | INTRODUCTION TO MICROSYSTEMS PACKAGING |
| 第 2 週 | THE ROLE OF PACKAGING IN MICROELECTRONICS |
| 第 3 週 | THE ROLE OF PACKAGING IN MICROSYSTEMS |
| 第 4 週 | FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN |
| 第 5 週 | FUNDAMENTALS OF DESIGN FOR REUABILITY |
| 第 6 週 | FUNDAMENTALS OF THERMAL MANAGEMENT |
| 第 7 週 | FUNDAMENTALS OF SINGLE CHIP PACKAGING |
| 第 8 週 | Mid-term exam |
| 第 9 週 | FUNDAMENTALS OF MULTICHIP PACKAGING |
| 第 10 週 | FUNDAMENTALS OF IC ASSEMBLY |
| 第 11 週 | FUNDAMENTALS OF WAFER-LEVEL PACKAGING |
| 第 12 週 | FUNDAMENTALS OF PASSIVES: DISCRETE, INTEGRATED, AND EMBEDDED |
| 第 13 週 | FUNDAMENTALS OF OPTOELECTRONICS |
| 第 14 週 | FUNDAMENTALS OF RF PACKAGING |
| 第 15 週 | FUNDAMENTALS OF MICROELECTROMECHANICAL SYSTEMS |
| 第 16 週 | Final exam |
| 第 17 週 | Make-up week |
| 第 18 週 | Make-up week |
教科書
FUNDAMENTALS OF MICROSYSTEMS PACKAGING By Rao R. Tummala McGRAW-HILL
Office Hours
- 時間
- Monday 17:00-18:00
- 聯絡方式
- wuchingchou@mail.nctu.edu.tw