前瞻CMOS製程整合工程
Advanced CMOS Process Integration Engineering
| 節 | 週五 |
|---|---|
5 13:20–14:10 | 前瞻CMOS製程整合工程 ED202 3 節連堂 |
6 14:20–15:10 | |
7 15:30–16:20 |
* 根據陽明交大上課時間表所列
A qualified process integration engineer requires to possess interdisciplinary knowledge across advanced CMOS device physics, semiconductor fabrication process, and basic CMOS device/standard cell/SRAM designs. Yield enhancement and reliability qualification are also important functional areas. The goal of this course is to provide the comprehensive and practical approaches to introduce the aforementioned subjects with sufficient depth for students interested in the process integration engineering (PIE) by lecturers from industry.
Semiconductor Device and Physics (Required); Basic knowledge in CMOS circuits (Preferred)
上課為保障智慧財產權,不得照相、錄音或錄影。
Mid-Term Exam 50% Final Exam 50%
| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction |
| 第 2 週 | Technology Definition, Evolution of CMOS device, and Process Modules Overview |
| 第 3 週 | Basic Process Introduction (TSMC 林義雄老師) |
| 第 4 週 | Fabrication processes of advanced CMOS-OD, S/D, Gate |
| 第 5 週 | Fabrication processes of advanced CMOS-MEOL/BEOL |
| 第 6 週 | Process defects & yield enhancement (TSMC 林義雄老師) |
| 第 7 週 | Device Engineering & TCAD(TSMC陳建宏老師) |
| 第 8 週 | Holiday Week |
| 第 9 週 | Mid Term Exam |
| 第 10 週 | Device Engineering & TCAD(TSMC陳建宏老師) |
| 第 11 週 | Device Engineering & TCAD(TSMC陳建宏老師) |
| 第 12 週 | Device Engineering & TCAD(TSMC陳建宏老師) |
| 第 13 週 | Lithography/Patterning Technology(ASML陳俊光老師) |
| 第 14 週 | Lithography/Patterning Technology(ASML陳俊光老師) |
| 第 15 週 | Standard cells and SRAM Cells(TSMC林義雄老師) |
| 第 16 週 | Final Exam |
| 第 17 週 | Product Development Cycle(TSMC林義雄老師) |
| 第 18 週 |
課程講義
- 時間
- By appointment