先進電子構裝技術
Advanced Electronic Packaging Technology
| 節 | 週三 |
|---|---|
2 09:00–09:50 | 先進電子構裝技術 A306 3 節連堂 |
3 10:10–11:00 | |
4 11:10–12:00 |
* 根據陽明交大上課時間表所列
Due to the increasing demand for compact electronic devices, miniaturization of integrated circuits (IC) following Moore's Law has long been the central focus of the semiconductor industry. Electronic packaging technology, located at the latter part of the semiconductor manufacturing process, serves as the final puzzle of seeking such demand. This course aims to give a comprehensive introduction on electronic packaging technologies, encompassing the interconnect hierarchy from chip-scale to system integration levels, the materials in electronic packaging, the validation methods for the package system to evaluate reliability from a scientific point of view through failure analysis, and the current developing trend in this industry.
None
1.Homework and Assignments, Exams and Quizzes, Evaluation and Grading Policy: None 2. Pedagogy and other supplementary information (websites, TAs, handouts and/or databases) : Midterm 40%, Final exam 40%, Final Report 20%.
| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction and Overview of Electronic Packaging |
| 第 2 週 | Assembly and Process Technology in Electronic Packaging |
| 第 3 週 | Chip-Scale Interconnection Technology in Brief – Wire bonding, Flip-Chip Bonding, Tape-Automated-Bonding |
| 第 4 週 | Materials for Electronic Packaging I – Soldering |
| 第 5 週 | Materials for Electronic Packaging II – Wire bonding |
| 第 6 週 | Materials for Electronic Packaging III - Printed Circuit Board, Encapsulation, and Substrates |
| 第 7 週 | Multichip and 3D-IC Packaging I – From 2D to 3D |
| 第 8 週 | Multichip and 3D-IC Packaging II – Die-to-Die, Fan-Out Wafer/Panel Level Packaging |
| 第 9 週 | Mid-term |
| 第 10 週 | Electrical Considerations in Electronic Packaging (Resistivity, Shielding, Electromagnetic Interference) |
| 第 11 週 | Thermal and Mechanical Considerations in Electronic Packaging |
| 第 12 週 | Electromigration & Thermal Migration |
| 第 13 週 | Reliability and Package Failure Analysis in Electronic Packaging I – Validation |
| 第 14 週 | Reliability and Package Failure Analysis in Electronic Packaging I – Analysis |
| 第 15 週 | Insight into Power Electronics Packaging |
| 第 16 週 | Final Exam |
Textbook: Advanced Electronic Packaging 2nd edition, Richard K. Ulrich & William D. Brown, Wiley-IEEE Press, February 2006, ISBN: 978-0-471-46609-3. Reference books: 1. Materials for Advanced Packaging 2nd Edition, Daniel¬ Lu¬ & C.P.-Wong, Springer, 2009. 2. Wire bonding in microelectronics 3rd edition, George Harman, McGraw-Hill, 2009. 3. K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging Science and Engineering, Wiley 2021. 4. K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability, Springer, 2007.