DRAM設計、製程與應用概論
DRAM Design, Process and Application
| 節 | 週二 |
|---|---|
5 13:20–14:10 | DRAM設計、製程與應用概論 A306 3 節連堂 |
6 14:20–15:10 | |
7 15:30–16:20 |
* 根據陽明交大上課時間表所列
Course Overview and Objectives: With the application of 5G, artificial intelligence, cloud computing, smart healthcare, and digital transformation, they need not only memory configuration but also memory speed and power performance, which are linked to the competitiveness of the products developed. This course is taught by Micron Technology, the world's third largest memory company on DRAM memory technology from an industry perspective. This course's objective is to help students further integrate what they have learned with relevant research and industry. This course provides a comprehensive overview, covering various aspects related to DRAM. By taking this course, students gain insights into DRAM technology, industry trends, challenges, and the strategic value of memory R&D and manufacturing in Taiwan. 隨著5G運用、人工智慧、雲端運算、智慧醫療和數位轉型,相關終端應用包含高階伺服器、AI運算顯示卡、雲端電腦及5G通訊等,不僅僅只是需要配置記憶體,記憶體速度與功率表現直接攸關開發產品競爭力,多樣化記憶體產品應用及重要性正逐年提升 。 本課程由全球第三大的記憶體公司美光科技,由業界觀點分別講授DRAM記憶體技術。幫助學生未來能進一步將所學與相關研究與產業結合。 本課程將從DRAM前段的研發設計、晶圓的生產製造、測試、故障分析與品質管理,到後段封裝測試以及產品應用,提供一系列的介紹,引導學員了解DRAM與應用與趨勢、技術及挑戰,以及記憶體在台研發製造的戰略價值。
Homework Assignments (30%); Mid-term Exam (30%); Final Exam (30%); Attendance (10%)
| 週次 | 主題 |
|---|---|
| 第 1 週 | Opening and briefing DRAM overview |
| 第 2 週 | DRAM Design, Device (DEG) What's DRAM & Application DRAM Architecture/Product Testing Front End Fabrication Diffusion Process |
| 第 3 週 | Photo Process Dry Etch Process |
| 第 4 週 | Thin Film Process CMP Process WET Process |
| 第 5 週 | Methodology Application CSM Overview Machine Learning on Advanced Process Control |
| 第 6 週 | Advanced Defect detection MQC(Material Quality Control) Contamination Control - Cleanroom/Cleanliness/AMC/ESD management |
| 第 7 週 | SMAI(Smart Manufacturing & Artificial Intelligence) Data engineering challenges in semiconductor data Machine learning challenges in production Deep learning for memory array failure classification |
| 第 8 週 | 8D Problem Solving Basics Model-Based Problem Solving |
| 第 9 週 | Mid-term Exam |
| 第 10 週 | Problem Solving DMAIC Training |
| 第 11 週 | Green New Fab design & construction Smart Facility operation Sustainability concept & achievement |
| 第 12 週 | AMHS introduction Operation intelligence introduction Layout introduction |
| 第 13 週 | DRAM probing and failure analysis BE Package & Test Assembly Package Introduction Advanced package introduction - now and future |
| 第 14 週 | The Role of CMOS Technology in Pushing DRAM Boundaries Field Application Engineering DRAM Basic Operations and (System) Design Considerations Market requirements vs. different type of DRAM and trend Features of DDR4/DDR5/LPDDR4/LPDDR5/GDDR6x Near Memory, Main Memory and Far Memory High speed memory design guide and considerations |
| 第 15 週 | Live Safe Understanding the Impact of an Injury Live Safe - Introduction 3 Core Principles of Live Safe Global Safety Rules and Empowerment to Stop Work Behavioral Safety |
| 第 16 週 | Final Exam Micron interaction with students open discussion |
- 時間
- By appointments