半導體構裝和異質整合技術
Semiconductor packaging and Heterogeneous Integration Technology
| 節 | 週二 |
|---|---|
A 18:30–19:20 | 半導體構裝和異質整合技術 A305 2 節連堂 |
B 19:30–20:20 |
* 根據陽明交大上課時間表所列
For this course; 1. Introduce the essential technologies used in semiconductor packaging including substrates (organic, silicon, glass), interconnection technology (wire bonding, flip chip, solders), and system electrical and thermal requirements. 2. heterogeneous integration technology; chiplets and technology such as CoWoS-X and EMIB process. Optical connection CPO. Use examples of server packaging such as NVidia H200 and B200 and Apple InFO and MX
Basic Semiconductor, Physics, chemistry, and material science knowledge.
作業10%,期中考(OPEN BOOK)45%,期末報告45%
| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction to semiconductor packaging Overview of semiconductor packaging Its importance and applications Current Trends and Future Directions Introduction to Heterogeneous Integration Overview of Heterogeneous Integration Its Importance and AI Applications Current Trends and Future Directions |
| 第 2 週 | |
| 第 3 週 | Electrical Design and Characterization (1) Electrical requirements in system design Electrical Interconnects and Signal Integrity Electrical Design and Characterization (2) Electrical Interconnects and Signal Integrity Power Delivery Networks Chiplets |
| 第 4 週 | |
| 第 5 週 | Substrate in electronic packaging (1) Organic substrate Organic Material and process Glass substrate Substrate in electronic packaging (2) Silicon interposer TSV process and CoWoS |
| 第 6 週 | |
| 第 7 週 | Interconnection technology (1) Wire bonding Solder connection Flip Chip Interconnection technology (2) Copper-to-copper direct bonding Wafer-to-wafer bonding Die-to-wafer bonding |
| 第 8 週 | |
| 第 9 週 | (1) Mid term examine 1Hr. (2)RDL and integration of substrate Technology Fan-in and Fan-out WLP 2.XD integrated substrate structure and process |
| 第 10 週 | |
| 第 11 週 | Electronic packaging modeling Electronic Packaging Process simulation Digital twin Thermal Design and Management Thermal Challenges in Heterogeneous Integration Thermal Interface Materials Cooling Solutions and Thermal Management Strategies |
| 第 12 週 | |
| 第 13 週 | Reliability in the electronic system Reliability testing spec and method System reliability Optical electronic packaging Introduction to optical-electronic packaging Components in CPO Future trend of CPO |
| 第 14 週 | |
| 第 15 週 | (1)Leading electronic packaging applications and HI systems NVidia H200 and B200 for servers Apple InFO and MX die-to-die integration Tesla Dojo Emerging packaging technology and the future of HI technology (2) Final report |
| 第 16 週 |
1. Advanced Electronic Packaging, Richard K. Ulrich; William D. Brown, Wiley-IEEE Press, 2006 2. Flip Chip, Hybrid Bonding, Fan-In and Fan-out Technology, John H. Lau, Springer Nature Singapore, 2024
- 聯絡方式
- hu@si2plus.com