電子封裝材料破壞學與失效概論
Introduction to Fractography and Failure Analysis in Electronic Packaging
| 節 | 週四 |
|---|---|
2 09:00–09:50 | 電子封裝材料破壞學與失效概論 EE118 3 節連堂 |
3 10:10–11:00 | |
4 11:10–12:00 |
* 根據陽明交大上課時間表所列
The rapid evolution of electronics over the last decades has caused a higher level of reliability concerns because of the miniaturization, elevated power level and the harsh environment involved in these IC packages. In this context, failure analysis serves a key role in improving the design of the IC from the beginning and guiding the correct direction for better reliability and sustainability of these electronic devices. This course introduces fundamental concepts of failure analysis and analysis methods, particularly for electronic packaging and materials.
None
Attendance+course response 10%, Midterm 30%, Presentation 30%, Final exam 30%
| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction and Overview of Failure Analysis I – general concepts |
| 第 2 週 | Introduction and Overview of Failure Analysis II - electronics |
| 第 3 週 | Observation of Fractography I - Macroscopic |
| 第 4 週 | Observation of Fractography II - Microscopic |
| 第 5 週 | Failure and Fracture Composition Analysis I – Surface analysis |
| 第 6 週 | Failure and Fracture Composition Analysis II – Sub-surface and bulk analysis |
| 第 7 週 | Nondestructive and destructive analysis |
| 第 8 週 | Midterm |
| 第 9 週 | Static failure modes and mechanisms I – ductile, brittle, and quasi-fracture |
| 第 10 週 | Static failure modes and mechanisms II – macro- and microscopic fractography |
| 第 11 週 | Fracture statistics |
| 第 12 週 | Fatigue and creep failure |
| 第 13 週 | Fracture Mechanics |
| 第 14 週 | Corrosion failure |
| 第 15 週 | High temperature failure |
| 第 16 週 | Final Exam |
Textbook: Reference books: 1. Sullivan, Daniel J. D. and Carleton, Eric J.. Failure Analysis: High Technology Devices, Berlin, Boston: De Gruyter, 2022. https://doi.org/10.1515/9781501524790 2. 材料破損分析Failure Analysis，莊東漢， 五南圖書出版股份有限公司2007 3. Brooks, Charlie R., and Ashok Choudhury. 2002. Failure Analysis of Engineering Materials. 1st ed. New York: McGraw-Hill Education.