薄膜技術
Thin Film Technology
| 節 | 週五 |
|---|---|
1 08:00–08:50 | 薄膜技術 3 節連堂 |
2 09:00–09:50 | |
3 10:10–11:00 |
* 根據陽明交大上課時間表所列
This course is mainly for the fundamental theory of film theory and technology and surface analysis, combined with semiconductor film process technology. At the start of this course, the fundamental subjects needed in thin-film processes, such as deposition, surface energy, atomic diffusion, and stress and strain in thin films will be introduced. After that, chapters on electron-migration, thermo-migration, and stress-migration will be discussed. It is expected to strengthen students' professional knowledge in film technology and surface inspection, so that students can establish a basic understanding of thin film science and expertise related to thin film processes.
Fundamental physics, chemistry, and mathematics
Homework and Assignments: 25% Midterm exam: 25% Final exam: 50%
| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction |
| 第 2 週 | Thin film deposition |
| 第 3 週 | Surface energies |
| 第 4 週 | Surface energies |
| 第 5 週 | Atomic diffusion in solids |
| 第 6 週 | Atomic diffusion in solids |
| 第 7 週 | Stress and strain in thin films |
| 第 8 週 | Midterm test |
| 第 9 週 | Surface kinetic processes on thin films |
| 第 10 週 | Inter-diffusion and reaction in thin films |
| 第 11 週 | Grain-boundary diffusion |
| 第 12 週 | Electro-migration in metals |
| 第 13 週 | Thermo-migration |
| 第 14 週 | Stress migration in thin films |
| 第 15 週 | Reliability science and analysis |
| 第 16 週 | Final Exam |
Textbooks: Lecture Notes References: 1. Electronic thin film reliability, King-Ning Tu, Cambridge University Press, July 2014 2. Electronic Thin film Science for electrical engineering and materials scientists, K. N. Tu, J. W. Mayer, and L. C. Feldman, MacMillan, 1996
- 地點
- VNU-HUS
- 時間
- Friday 13:00-16:00
- 聯絡方式
- daoquangduy@hus.edu.vn